PS12018-A

Overview

The PS12018-A is a flat-base insulated Application Specific Intelligent Power Module (ASIPM) manufactured by Mitsubishi Semiconductor. It integrates a three-phase IGBT inverter bridge with dynamic braking capability, designed for AC400V class motor control applications. The module features integrated drive circuits, high-speed photo-couplers, and comprehensive protection functions including short circuit, under-voltage, over-voltage, and over-temperature protection. It supports 5V CMOS/TTL compatible inputs and provides analogue current feedback signals.

Feature Summary

• Integrates a three-phase IGBT inverter bridge with N-side open emitter structure and dynamic braking circuitry.
• Includes internal high-speed photo-couplers enabling direct CPU coupling without external isolation components.
• Provides comprehensive system control functions such as short circuit protection, under/over-voltage locking, and over-temperature fault signaling.
• Features analogue signal output to reproduce actual inverter output phase currents for system feedback control.

Applications

• Acoustic noise-less 3.7kW AC400V Class 3 Phase inverters
• General motor control applications
• Systems requiring integrated drive and protection logic

Procurement Notes

Verify the component status carefully, as the source document is marked as preliminary with parametric limits subject to change. Confirm that the specific package outline and terminal assignments match your design requirements. Ensure that the thermal resistance values and mounting torque specifications are strictly adhered to during assembly to maintain safe operating junction temperatures.

Selection Notes

Select this module for applications requiring a compact solution combining power switching and intelligent control logic. It is suitable for designs needing built-in shoot-through interlock protection and analogue current sensing. Consider the thermal management requirements associated with the flat-base type construction and the necessity of applying thermal grease between the case and fin.

Part Context

This component belongs to the Mitsubishi Semiconductor ASIPM family, specifically designed for three-phase inverter systems. It utilizes third-generation IGBT and diode technologies to achieve high efficiency and reliability. The module consolidates multiple discrete components into a single insulated package, simplifying the PCB layout and reducing the overall system footprint for industrial motor drives.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult official manufacturer resources for cross-reference information or updated series replacements.