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The PS2561BL-1-F3-A is a single-channel transistor output optocoupler manufactured by Renesas Electronics. It features an NPN phototransistor output and provides 5000 Vrms insulation voltage for signal isolation. The device operates within a temperature range of -55°C to +110°C, supporting high-temperature applications. It utilizes a surface-mount DIP-4 gull wing package configuration. Key electrical parameters include a maximum collector-emitter voltage of 80V and a maximum collector current of 50mA. The component is part of the PS2561B series and is designated as Not Recommended for New Designs (NRND).
Verify the current lifecycle status before procurement, as this component is classified as Not Recommended for New Designs. Confirm availability through authorized distributors or secondary market suppliers. Ensure that the specific suffix matches the required package and compliance specifications. Review the latest datasheet for any potential design-in restrictions or recommended replacement alternatives.
Select this component when high-temperature stability and robust isolation are required for single-channel applications. Consider the NPN output type for compatibility with standard logic interfaces. Evaluate the surface-mount package constraints against PCB layout requirements. Compare performance metrics such as current transfer ratio and switching speed against alternative optocouplers if new designs are being initiated.
This component belongs to the Renesas PS2561 family of optocouplers, which are widely used for electrical isolation in electronic circuits. The PS2561BL variant specifically denotes high-temperature capability and a surface-mount package. The family is known for providing reliable signal transmission across isolated barriers while maintaining compact form factors suitable for modern electronics manufacturing.
Consult official Renesas documentation for verified substitute part numbers. Cross-reference specifications such as isolation voltage, pinout, and package dimensions when evaluating alternatives. Ensure that any replacement maintains compatibility with existing thermal and electrical design constraints.