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The PS2561DL2-1Y-F3-A is a single-channel transistor output optocoupler manufactured by Renesas Electronics. It features an NPN phototransistor output and operates in a DIP-4 Gull Wing surface mount package. The device provides 5000 Vrms isolation voltage with a collector-emitter voltage of 80 V and maximum collector current of 50 mA. Current transfer ratio ranges from 50% to 400%. Forward voltage is 1.4 V at 40 mA forward current. Switching characteristics include a rise time of 3 µs and fall time of 5 µs. Maximum collector-emitter saturation voltage is 300 mV.
Verify component authenticity through authorized Renesas distributors or certified partners. Confirm RoHS compliance status and specific suffix designations match project requirements. Check datasheet revisions for parameter updates before finalizing procurement orders. Ensure storage conditions meet manufacturer specifications to maintain device integrity during handling and installation processes.
Select this component when high isolation voltage and long creepage distance are required in surface mount applications. Consider the wide current transfer ratio range for varying signal amplification needs. Evaluate thermal performance within the specified operating temperature range. Compare switching speeds against circuit timing requirements to ensure adequate response times for digital signal processing tasks.
This part belongs to the PS2561 series of photocouplers designed for general-purpose isolation applications. The DL2 variant specifically indicates a surface mount package with extended creepage distance leads. The Y-F3 suffix typically denotes specific tape and reel packaging configurations or quality certifications. This series supports both DC and low-frequency AC signal transmission across isolated boundaries.
PS2561BL2-1-E3-A offers similar specifications with comparable isolation and switching characteristics. PS2561DL-1 provides equivalent functionality in standard surface mount packages without extended creepage features. Verify pinout compatibility and thermal resistance values when substituting components in existing designs.