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The PS2711-1-V-M-A is a single-channel optocoupler manufactured by Renesas Electronics Corporation. It integrates a Gallium Arsenide (GaAs) infrared emitting diode with an NPN silicon phototransistor within a compact four-pin Small Outline Package (SOP). The device provides a high current transfer ratio of 200% typical at a forward current of 1mA. It offers a high isolation voltage rating of 3,750 Vrms, ensuring reliable signal transmission across isolated circuits while maintaining electrical safety standards for sensitive electronic applications.
Verify the specific suffix -V-M-A against official Renesas documentation to confirm package type and compliance status. Ensure the component matches the required isolation voltage and current transfer ratio specifications for your design. Cross-reference ordering codes with authorized distributors to avoid counterfeit parts. Confirm RoHS compliance and lead-free status as stated in the datasheet before finalizing procurement orders.
Select this component when high isolation voltage and compact form factor are critical. The high CTR ensures reliable switching with low input current. Consider the SOP package dimensions for PCB layout constraints. Verify that the NPN output configuration aligns with the receiving circuit requirements. Ensure operating conditions remain within the specified temperature range for consistent performance.
This part belongs to the PS2711 series of photocouplers from Renesas Electronics. The series is designed for general-purpose isolation applications. The PS2711-1 variant specifically denotes a single-channel configuration. The -V-M-A suffix indicates specific packaging and compliance attributes defined by the manufacturer. This family supports various industrial and automotive isolation needs.
Consult official Renesas substitution guides for verified equivalents. Generic replacements may not match the specific 3,750 Vrms isolation or 200% CTR characteristics. Ensure any substitute maintains the same pinout and package dimensions for direct compatibility without redesigning the PCB footprint.