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The PS8101-AX is a high-speed optically coupled isolator manufactured by Renesas Electronics. It integrates a GaAlAs LED on the input side with a PIN photodiode and high-speed amplifier transistor on the output side within a single chip. The device operates in a 5-pin SOIC (SO-5) surface-mount package, supporting a data rate of 1 Mb/s. Key electrical specifications include an isolation voltage of 3750 Vrms, a maximum forward current of 16 mA, and a forward voltage of 1.7 V. The unit features a supply voltage capability of up to 35 V and supports an operating temperature range from -55°C to 100°C.
Verify the specific suffix designation against official Renesas documentation to confirm exact packaging and tape-and-reel specifications. Ensure that the selected variant matches the required lead-free status and RoHS compliance standards for your manufacturing process. Cross-reference the ordering number with the manufacturer's current datasheet revision to avoid discrepancies in pinout or performance characteristics during procurement.
Select this component when designing circuits that require high-speed digital isolation with a 1 Mbps data rate. The SO-5 package is appropriate for space-constrained layouts. Consider the 3750 Vrms isolation rating for safety-critical applications. Verify that the input current requirements align with the driving source capabilities and that the output configuration suits the receiving logic family.
The PS8101 belongs to the NEPOC series of photocouplers produced by Renesas Electronics. This series focuses on providing reliable optical isolation solutions for various electronic systems. The PS8101 specifically targets applications needing high common-mode rejection and fast switching speeds within a compact form factor, distinguishing it from slower or larger packaged alternatives in the broader portfolio.
Consult official cross-reference lists for verified substitutes. Ensure any replacement maintains the 1 Mbps data rate, 3750 Vrms isolation, and SO-5 package dimensions. Verify compatibility with existing PCB footprints and electrical parameters before implementation.