PSS30S92F6-AG

PSS30S92F6-AG

$18.50
  • Description:MOD IPM 6-PAC 30A 600V DIP
  • Series:-

SKU:1da6edea071d Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:MOD IPM 6-PAC 30A 600V DIP
  • Series:-
  • Mfr:Powerex Inc.
  • Package:Tube
  • Type:IGBT
  • Configuration:3 Phase
  • Current:30 A
  • Voltage:600 V
  • Voltage - Isolation:1500Vrms
  • Mounting Type:Through Hole
  • Package / Case:25-PowerDIP Module (1.134", 28.80mm)
  • Grade:-
  • Qualification:-

Download product information

PSS30S92F6-AG

Overview

The PSS30S92F6-AG is a dual-in-line package intelligent power module manufactured by Mitsubishi Electric Semiconductor. It integrates switching and rectification components into a single compact unit designed for high-power density applications. The module provides a robust solution for power conversion systems requiring integrated control logic and protection features within a standardized DIP form factor.

Feature Summary

  • Integrates power switching elements with drive circuitry in a single package
  • Includes built-in protection mechanisms for enhanced system reliability
  • Utilizes dual-in-line packaging for simplified board mounting and thermal management

Applications

  • Industrial motor drives
  • Switching power supplies
  • Inverter circuits

Procurement Notes

Verify the manufacturer designation carefully, as the component is produced by Mitsubishi Electric Semiconductor while Powerex Inc. appears in associated search metadata. Confirm the specific suffix AG against official datasheets to ensure correct pinout and electrical characteristics before procurement.

Selection Notes

Select this module when space constraints require an integrated intelligent power solution. Ensure the application voltage and current ratings align with the module's specifications. Consider the thermal requirements of the DIP package for adequate heat dissipation in the final design.

Part Context

This component belongs to the family of intelligent power modules (IPMs) that combine power semiconductors with gate drivers. These modules simplify the design of power electronics by reducing component count and interconnection complexity compared to discrete solutions.

PSS30S92F6-AGPSS30S92F6-AG
$18.50
Buy Now