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PT7C4563BZEEX is listed in the Real Time Clock range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is IC RTC I2C/2-WIRE SER 8TDFN T&R. Review the specifications below when checking this part for your BOM.
The PT7C4563BZEEX is a Real-Time Clock (RTC) module manufactured by Diodes Incorporated, utilizing an I2C bus interface. It operates within a supply voltage range of 1.3V to 5.5V and supports an industrial temperature range from -40°C to +85°C. The device features a built-in oscillator for a 32.768kHz crystal, providing timekeeping in 24-hour format with a century bit. Key functions include alarm interrupts, programmable square wave outputs at selectable frequencies (1Hz, 32Hz, 1.024kHz, 32.768kHz), and oscillator fail detection. It is housed in an 8-pin TDFN package.
Verify component authenticity through authorized distributors. Confirm RoHS compliance status as per manufacturer specifications. Ensure packaging integrity for surface-mount assembly. Check for obsolescence notices as product lifecycle status may change. Validate electrical parameters against specific application requirements before procurement.
Select this component for applications requiring I2C connectivity and low-voltage operation down to 1.3V. Consider the 8-pin TDFN package for space-constrained designs. Ensure external 32.768kHz crystal selection matches load capacitance requirements. Verify that system voltage levels are compatible with the specified input/output thresholds.
The PT7C4563BZEEX belongs to the PT7C4563B series of Real-Time Clock modules. It shares functional similarities with other variants like PT7C4563CLEX but differs in package type. The 'ZE' suffix specifically denotes the 8-pin TDFN (2x3mm) package configuration. This series is designed for cost-effective timekeeping solutions in embedded environments.
Direct substitutes must match the I2C interface, voltage range, and package dimensions. Verify register compatibility if replacing with similar RTC ICs. Consider thermal characteristics and mechanical footprint when selecting alternative packages such as SOIC-8 or TSSOP-8 from the same family.
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