QCA-6174A-3-172BWLNSP-SR-0C-0

Overview

The Qualcomm QCA-6174A-3-172BWLNSP-SR-0C-0 is a System-on-Chip (SoC) integrating 2x2 dual-band 802.11ac Wi-Fi and Bluetooth 5.0. It supports low-power SDIO 3.0 for WLAN and UART/PCM for Bluetooth. The device operates on a single 3.3 V power supply with 1.8 V or 3.3 V I/O options. Memory includes 1216 KB RAM and 448 KB ROM for Wi-Fi, plus 192 KB RAM and 672 KB ROM for Bluetooth. It features MU-MIMO, transmit beamforming, and advanced error correction for robust connectivity.

Feature Summary

• Integrates 2x2 802.11ac Wi-Fi and Bluetooth 5.0 in a single small form factor SoC
• Supports low-power SDIO 3.0 interface for WLAN and UART/PCM for Bluetooth
• Includes integrated RF front-end and single-ended design for simplified circuitry
• Optimized for energy efficiency to extend portable device battery life

Applications

• Mobile phones and tablets
• OTT media streaming devices
• Smart home automation systems
• Smart assistants and speakers

Procurement Notes

Verify the specific suffix -3 indicates the SDIO 3.0 variant when sourcing. Confirm package type WLNSP matches board layout requirements. Ensure firmware compatibility with the integrated Bluetooth 5.0 stack. Check that the 3.3V power domain aligns with system voltage rails. Validate regulatory certifications for target markets before final procurement.

Selection Notes

Select this model over PCIe variants if the host platform utilizes an SDIO interface for wireless connectivity. The UART/PCM Bluetooth interface suits designs lacking USB controllers for BLE functions. Consider the integrated RF frontend to reduce external component count and BOM cost. Evaluate memory sizes against application complexity requirements for both Wi-Fi and Bluetooth stacks.

Part Context

This component belongs to the Qualcomm QCA6174A family of combo chips. It provides a cost-effective solution for mobile and consumer electronics. The series integrates high-performance Wi-Fi and Bluetooth technologies into a compact footprint. It targets applications requiring seamless wireless connectivity with optimized power consumption profiles.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.