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QCN-9160-0-PSP229-MT-01-0 is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists Qualcomm. Its product description is QCN-9160-0-PSP229-MT-01-0. Review the specifications below when checking this part for your BOM.
The QCN-9160-0-PSP229-MT-01-0 is a Qualcomm System-in-Package (SiP) module integrating the QCNFA532 Wi-Fi 6E/7 and Bluetooth 5.4 combo chip with the QFE7100 front-end module. It supports IEEE 802.11be, 802.11ax, and 802.11ay standards across 2.4 GHz, 5 GHz, and 6 GHz bands. The package includes integrated passive components and an antenna switch, designed for compact form factors in mobile and IoT devices.
Verify component authenticity through authorized distributors or direct manufacturer channels. Ensure compliance with regional radio certification requirements such as FCC, CE, and SRRC before integration. Confirm supply chain stability and lead times with official partners to mitigate production delays.
Select this module for applications demanding simultaneous high-performance Wi-Fi 6E/7 and Bluetooth 5.4 support. Evaluate board space limitations as the SiP format offers reduced footprint compared to discrete solutions. Consider thermal management requirements due to high-frequency operation in dense packaging.
This part belongs to Qualcomm's QCN series of connectivity modules, specifically designed for modern mobile platforms. It complements the Snapdragon processor ecosystem by providing robust wireless infrastructure. The module represents the evolution from previous Wi-Fi 6 solutions to support next-generation bandwidth demands.
No direct public substitute part numbers are confirmed for this specific SKU. Discrete alternatives may require significant redesign of RF circuits and firmware adaptation. Consult official documentation for compatible pin-to-pin replacements if available.
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