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R1LV0208BSA-5SI#S0 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 2MBIT PARALLEL 32TSOP I. Review the specifications below when checking this part for your BOM.
Memory IC specifications for R1LV0208BSA-5SI#S0
- Description：IC SRAM 2MBIT PARALLEL 32TSOP I
- Series：-
- Mfr：Renesas Electronics Corporation
- Package：Tape & Reel (TR)
- Memory Type：Volatile
- Memory Format：SRAM
- Technology：SRAM
- Memory Size：2Mbit
- Memory Organization：256K x 8
- Memory Interface：Parallel
- Clock Frequency：-
- Write Cycle Time - Word, Page：55ns
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：32-TFSOP (0.465", 11.80mm Width)
- Supplier Device Package：32-TSOP I
- Access Time：55 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for R1LV0208BSA-5SI#S0
Memory IC Overview
The R1LV0208BSA-5SI#S0 is a 2 Mbit (256K x 8) Low Power Static Random Access Memory (SRAM) manufactured by Renesas Electronics. It features a parallel interface with a maximum access time of 55 ns. The device operates on a single power supply ranging from 2.7 V to 3.6 V, with a typical standby current of 1 µA at 3.0 V. It supports TTL-compatible inputs and outputs and requires no clocks or refresh cycles. The component is housed in a 32-TSOP I package and is rated for an operating temperature range of -40°C to +85°C.
Memory IC Feature Summary
- Low power consumption with typical standby current of 1 µA
- Parallel memory interface without clock or refresh requirements
- TTL-compatible input and output logic levels
Memory IC Applications
- Embedded systems requiring non-volatile-like data retention during power loss
- Industrial control units operating in extended temperature environments
- Consumer electronics utilizing 3V logic families
Memory IC Procurement Notes
Verify the specific suffix #S0 against the manufacturer's datasheet to confirm packaging configuration. Confirm RoHS compliance status and moisture sensitivity level prior to integration. Ensure the design accounts for the specified voltage range and thermal characteristics for reliable operation within the stated temperature limits.
Memory IC Selection Notes
Select this component for applications requiring fast parallel access and low standby power. Compare the 256K x 8 organization against system memory requirements. Verify that the 32-TSOP I footprint matches the PCB layout constraints. Ensure the 55 ns access time meets the timing specifications of the host processor or controller.
Memory IC Part Context
This part belongs to the R1LV0208BSA series of low-power SRAMs from Renesas. The series is designed for battery-powered and general-purpose applications where power efficiency and speed are critical. The TSOP package offers a compact solution for surface-mount assembly.
Memory IC Replacement Considerations
Check for direct pin-to-pin replacements within the same family, such as the R1LV0208BSA-5SI#S1 variant, which may differ only in packaging tape-and-reel specifications. Verify functional equivalence before substitution.
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