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R573F33215
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Product Detailed Parameters
- Description：SP12T RAMSES SMA 18GHZ LATCHING
- Series：SPnT
- Mfr：Radiall USA, Inc.
- Package：Bulk
- Product Status：Active
- RF Type：General Purpose
- Topology：Reflective
- Circuit：SP12T
- Frequency Range：0Hz ~ 18GHz
- Isolation：50dB (min)
- Insertion Loss：0.8dB (max)
- Test Frequency：18GHz
- Impedance：50Ohm
- Voltage - Supply：24V ~ 30V
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Chassis Mount
- Package / Case：-
- P1dB：-
- IIP3：-
- Features：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The R573F33215 is a general-purpose RF switch IC manufactured by Radiall USA, Inc. It functions as a Single-Pole 12-Throw (SP12T) switch with a characteristic impedance of 50 Ohms. This component is designed for radio frequency and wireless applications, providing signal routing capabilities within electronic systems.
Feature Summary
- Configured as an SP12T switch for multi-path signal routing
- Operates at a standard 50 Ohm system impedance
Applications
- Radio frequency circuit design
- Wireless communication systems
Procurement Notes
Verify the specific datasheet version and electrical performance characteristics directly with Radiall or authorized distributors before procurement. Confirm that the SP12T configuration meets the required signal path count for the intended application. Ensure compatibility with the operating voltage and control logic levels specified in the official documentation.
Selection Notes
Select this component when a single input requires switching to one of twelve distinct output paths in a 50 Ohm environment. The SP12T topology is suitable for complex antenna arrays or test setups requiring extensive channel selection. Verify that the package type and pinout align with the PCB layout constraints.
Part Context
This part belongs to the Radiall USA, Inc. portfolio of RF switches. It is categorized under general-purpose RF switch ICs. The manufacturer specializes in interconnect solutions for demanding environments, including space-qualified components and cryogenic quantum computing interconnects.
