R7F701396AEABG-C#BC1

$20.10

Description：IC MCU 32BIT 4MB FLASH 156LFBGA
Series：RH850/P1H-C
Mfr：Renesas Electronics Corporation
Package：Tray
Core Processor：RH850G3M

SKU:c5314458bb7c Category: Microcontrollers Brand: Renesas Electronics Corporation

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Product introduction

R7F701396AEABG-C#BC1 is listed in the Microcontrollers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC MCU 32BIT 4MB FLASH 156LFBGA. Review the specifications below when checking this part for your BOM.

Microcontrollers specifications for R7F701396AEABG-C#BC1

Description：IC MCU 32BIT 4MB FLASH 156LFBGA
Series：RH850/P1H-C
Mfr：Renesas Electronics Corporation
Package：Tray
Core Processor：RH850G3M
Core Size：32-Bit Quad-Core
Speed：240MHz
Connectivity：CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals：DMA, POR, PWM, Temp Sensor, WDT
Number of I/O：-
Program Memory Size：4MB (4M x 8)
Program Memory Type：FLASH
EEPROM Size：128K x 8
RAM Size：1.0625M x 8
Voltage - Supply (Vcc/Vdd)：3V ~ 3.6V
Data Converters：A/D 16x12b
Oscillator Type：Internal
Operating Temperature：-40°C ~ 150°C
Mounting Type：Surface Mount
Supplier Device Package：156-FBGA (10x10)
Package / Case：156-LFBGA
Grade：-
Qualification：-

Microcontrollers datasheet and documents for R7F701396AEABG-C#BC1

R7F701396AEABG-C#BC1

Microcontrollers Overview

The R7F701396AEABG-C#BC1 is a 32-bit microcontroller from the Renesas RH850/P1H-C series. It features the RH850G3M quad-core processor with a maximum operating frequency of 240MHz. The device integrates 4MB of flash memory and 1.0625MB of RAM. It includes 32-channel 12-bit A/D converters and supports interfaces such as CANbus, FlexRay, LINbus, SENT, SPI, and UART/USART. Operating voltage ranges from 3V to 3.6V, with an extended temperature range of -40°C to 150°C in a 292-FBGA package.

Microcontrollers Feature Summary

Quad-core architecture for high-performance parallel processing
Automotive-grade reliability with wide temperature tolerance
Integrated safety mechanisms including self-test modes
Support for advanced automotive communication protocols

Microcontrollers Applications

Advanced driver assistance systems (ADAS)
Vehicle body control modules
Powertrain control units
Chassis electronic control units

Microcontrollers Procurement Notes

Verify the specific suffix BC1 against official Renesas documentation to confirm pinout and packaging details. Confirm RoHS compliance status and moisture sensitivity level prior to assembly. Check for any recent product change notices regarding manufacturing sites or material substitutions. Ensure ESD handling procedures are followed during procurement and storage.

Microcontrollers Selection Notes

Select this component when a high-performance multi-core solution is required for complex automotive applications. The RH850G3M core offers significant processing power compared to single-core alternatives. Consider the extensive peripheral set for direct sensor interfacing. Evaluate the FBGA package size constraints against available PCB real estate.

Microcontrollers Part Context

This part belongs to the RH850/P1H-C family, designed for demanding automotive environments. It shares architectural similarities with other G3M-based parts but differs in memory configuration and I/O count. The P1H-C series targets safety-critical functions requiring robust performance and functional safety compliance.