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R7F701432EABG#BC1 is listed in the Microcontrollers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC MCU 32BIT 5MB FLASH 484BBGA. Review the specifications below when checking this part for your BOM.
Microcontrollers specifications for R7F701432EABG#BC1
- Description：IC MCU 32BIT 5MB FLASH 484BBGA
- Series：RH850/D1x
- Mfr：Renesas Electronics Corporation
- Package：Tray
- Core Processor：RH850
- Core Size：32-Bit
- Speed：240MHz
- Connectivity：CANbus, Ethernet, I2C, LINbus, SPI
- Peripherals：POR, PWM
- Number of I/O：-
- Program Memory Size：5MB (5M x 8)
- Program Memory Type：FLASH
- EEPROM Size：64K x 8
- RAM Size：3.616K x 8
- Voltage - Supply (Vcc/Vdd)：2.7V ~ 5.5V
- Data Converters：A/D 20x12b Sigma-Delta
- Oscillator Type：Internal
- Operating Temperature：-40°C ~ 150°C
- Mounting Type：Surface Mount
- Supplier Device Package：484-BGA (27x27)
- Package / Case：484-BBGA
- Grade：-
- Qualification：-
Microcontrollers datasheet and documents for R7F701432EABG#BC1
Microcontrollers Overview
The R7F701432EABG#BC1 is a 32-bit microcontroller belonging to the RH850/P1X-C series, manufactured by Renesas Electronics. It features the RH850G3M core architecture and operates at a maximum frequency of 240MHz. The device integrates 4MB of flash memory and 1.0625MB of RAM within a 292-FBGA package measuring 17x17mm. It supports a supply voltage range of 3V to 3.6V and functions across an operating temperature range of -40°C to 150°C.
Microcontrollers Feature Summary
- Integrates the RH850G3M processor core for high-performance computing
- Includes extensive automotive communication interfaces such as FlexRay, LINbus, and CANbus
- Features built-in safety mechanisms compliant with ISO26262 functional safety standards
Microcontrollers Applications
- Advanced chassis control systems
- Automotive sensor fusion modules
- Vehicle gateway applications
Microcontrollers Procurement Notes
Verify component authenticity through authorized Renesas distributors or direct manufacturer channels. Confirm that the specific suffix matches the required package and temperature grade. Request official datasheets and security documentation directly from the supplier to ensure compliance with automotive quality standards before finalizing procurement.
Microcontrollers Selection Notes
Select this component when designing systems requiring high-speed processing and robust fault tolerance in automotive environments. Ensure the design accommodates the 292-FBGA package dimensions and thermal requirements. Verify that the available I/O count and peripheral interfaces align with the specific system connectivity needs.
Microcontrollers Part Context
This microcontroller is part of the RH850/P1X-C family, which targets high-end automotive applications. The series is engineered to support complex vehicle architectures requiring significant computational power and strict adherence to functional safety regulations. It serves as a central processing unit for critical vehicle subsystems.
Microcontrollers Replacement Considerations
Consult Renesas technical resources for verified cross-references. Substitution requires matching the G3M core specifications and FBGA package footprint.
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