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R7F701A223AFP#AA4 is listed in the Microcontrollers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC MCU 32BIT FLASH SMD. Review the specifications below when checking this part for your BOM.
Microcontrollers specifications for R7F701A223AFP#AA4
- Description：IC MCU 32BIT FLASH SMD
- Series：*
- Mfr：Renesas Electronics Corporation
- Package：Tray
- Core Processor：-
- Core Size：-
- Speed：-
- Connectivity：-
- Peripherals：-
- Number of I/O：-
- Program Memory Size：-
- Program Memory Type：-
- EEPROM Size：-
- RAM Size：-
- Voltage - Supply (Vcc/Vdd)：-
- Data Converters：-
- Oscillator Type：-
- Operating Temperature：-
- Mounting Type：-
- Supplier Device Package：-
- Package / Case：-
Microcontrollers datasheet and documents for R7F701A223AFP#AA4
Microcontrollers Overview
The R7F701A223AFP#AA4 is a 32-bit microcontroller from the Renesas RH850/F1L series, utilizing the RH850G3K core. It features 256KB of flash memory and 32KB of RAM, operating at a maximum speed of 80MHz with an internal oscillator. The device supports a supply voltage range of 3V to 5.5V and includes various peripherals such as DMA, PWM, and WDT. Connectivity options include CANbus, CSI, I2C, LINbus, SPI, and UART/USART. It offers multiple A/D converters (20x10b, 16x12b) and provides 81 I/O lines in a 100-LFQFP package.
Microcontrollers Feature Summary
- Integrates the RH850G3K 32-bit processor core for high-performance computing within automotive applications.
- Supports comprehensive communication protocols including CANbus, LINbus, and standard serial interfaces for system connectivity.
- Includes integrated analog-to-digital conversion capabilities with mixed resolution options for sensor interfacing.
Microcontrollers Applications
- Automotive body control modules
- Instrument cluster systems
- Door control units
Microcontrollers Procurement Notes
Verify component authenticity through authorized distributors or direct manufacturer channels due to potential counterfeit risks. Confirm RoHS compliance status and check for specific product change notices regarding packaging or labeling updates. Ensure storage conditions meet moisture sensitivity level requirements prior to assembly.
Microcontrollers Selection Notes
Evaluate pin count compatibility against the target PCB layout, as this model utilizes a 100-pin LFQFP package. Assess memory requirements to ensure the 256KB flash and 32KB RAM capacities suffice for the application firmware. Verify that the 3V to 5.5V operating voltage range aligns with the system power supply design.
Microcontrollers Part Context
This component belongs to the RH850/F1L family, designed for robust automotive environments. It shares architectural similarities with other parts in the G3K series but differs in memory size and I/O configuration. The part number suffix indicates specific package and temperature grade variations within the broader product line.
Microcontrollers Replacement Considerations
Consult official Renesas documentation for cross-reference data. No direct substitute part numbers are confirmed in the provided public records. Consider evaluating other members of the RH850/F1L family for functional equivalence if availability is constrained.
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