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Product Detailed Parameters
- Description：SOC RZ/G2H HDMI OFF (FULL)
- Series：RZ/G2E
- Mfr：Renesas Electronics Corporation
- Package：Tray
- Core Processor：ARM® Cortex®-A53, ARM® Cortex®-A57
- Number of Cores/Bus Width：4, 4 Core, 64-Bit
- Speed：1.2GHz, 1.5GHz
- Co-Processors/DSP：-
- RAM Controllers：LPDDR4
- Graphics Acceleration：Yes
- Display & Interface Controllers：DU
- Ethernet：10/100Mbps (1)
- SATA：-
- USB：USB 2.0 OTG (2), USB 3.0 (1)
- Voltage - I/O：3.3V
- Operating Temperature：-40°C ~ 85°C
- Security Features：-
- Mounting Type：Surface Mount
- Package / Case：1022-BFBGA, FCBGA
- Supplier Device Package：1022-FCBGA (29x29)
- Additional Interfaces：CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
- Grade：-
- Qualification：-
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Overview
The R8A774E0HA01BN#G6 is a System on Chip (SoC) within the Renesas RZ/G2H series, designed for specialized application processors. It integrates four ARM Cortex-A53 cores operating at 1.2GHz and two ARM Cortex-A57 cores running at 1.5GHz. The device features an integrated Display Unit (DU) and supports LPDDR4 memory controllers. Connectivity options include USB 2.0 OTG, USB 3.0, and Ethernet interfaces. It is housed in a 1022-pin FCBGA package measuring 29x29mm and operates within a temperature range of -40°C to 85°C.
Feature Summary
- Integrates heterogeneous multi-core architecture combining high-efficiency Cortex-A53 and high-performance Cortex-A57 processors
- Includes dedicated Display Unit (DU) for video output management
- Supports LPDDR4 RAM controller for high-bandwidth memory access
- Provides comprehensive peripheral connectivity including USB 3.0 and Ethernet
Applications
- Industrial automation systems requiring robust processing capabilities
- Smart infrastructure and IoT gateway devices
- Digital signage and information display terminals
- Medical equipment control units
Procurement Notes
Verify the specific suffix G6 against official Renesas documentation to confirm pinout and feature configuration. Ensure compatibility with existing board designs regarding the 1022-FCBGA footprint. Confirm supply chain availability through authorized channels as distribution status may vary by region.
Selection Notes
Select this component when a balance between power efficiency and computational performance is required. The inclusion of the DU makes it suitable for display-centric applications without external graphics controllers. Evaluate thermal management requirements given the dual-core cluster configuration and surface mount packaging constraints.
Part Context
This part belongs to the RZ/G2H family, which targets industrial and social infrastructure markets. It serves as a specialized application processor distinct from general-purpose microcontrollers, focusing on multimedia and connectivity tasks within embedded systems.
Replacement Considerations
R8A774E0HA01BN#G0 is a documented variant within the same series. Verify functional equivalence regarding HDMI interface availability and pin compatibility before substitution.
