ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
R8A779MBJXXXBA#GG is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is R-CAR H3NE-1.7G. Review the specifications below when checking this part for your BOM.
Soc System On Chip specifications for R8A779MBJXXXBA#GG
- Description：R-CAR H3NE-1.7G
- Series：-
- Mfr：Renesas Electronics Corporation
- Package：Tray
- Architecture：-
- Core Processor：-
- Flash Size：-
- RAM Size：-
- Peripherals：-
- Connectivity：-
- Speed：-
- Primary Attributes：-
- Operating Temperature：-
- Grade：-
- Qualification：-
- Package / Case：-
- Supplier Device Package：-
Soc System On Chip datasheet and documents for R8A779MBJXXXBA#GG
Soc System On Chip Overview
The R8A779MBJXXXBA#GG is an automotive system-on-chip belonging to the R-Car H3Ne series, manufactured by Renesas Electronics. It integrates a heterogeneous multi-core architecture comprising four Arm Cortex-A57 cores, four Arm Cortex-A53 cores, and dual lockstep Arm Cortex-R7 cores for functional safety compliance. The device supports high-performance multimedia processing with dedicated video input and output channels, hardware-accelerated image distortion compensation, and robust connectivity interfaces including USB 3.0, Ethernet AVB, and CAN-FD.
Soc System On Chip Feature Summary
- Complies with ISO 26262 ASIL-B automotive functional safety standards
- Integrates IMG PowerVR Series6XT GPU for advanced 3D graphics rendering
- Includes dedicated IP transformation and video codec modules for efficient media handling
- Supports LPDDR4 external memory with high bandwidth capabilities
Soc System On Chip Applications
- Advanced driver assistance systems (ADAS)
- In-vehicle infotainment (IVI) platforms
- Digital instrument clusters
- Automotive gateway solutions
Soc System On Chip Procurement Notes
Verify component authenticity through authorized Renesas distributors or direct manufacturer channels. Confirm that the specific suffix matches the required thermal and electrical specifications. Request official datasheets and quality certificates prior to integration. Ensure supply chain stability due to potential allocation constraints in the automotive sector.
Soc System On Chip Selection Notes
Select this SoC for applications requiring high computational throughput combined with strict functional safety requirements. Evaluate compatibility with existing R-Car ecosystem tools and software libraries. Consider the pinout and package dimensions against the target PCB layout. Verify support for required peripheral interfaces such as PCIe and multiple display outputs.
Soc System On Chip Part Context
This component is part of the R-Car H3 family, designed specifically for next-generation automotive electronics. It builds upon previous generations to offer enhanced performance while maintaining backward compatibility with established development environments. The H3Ne variant focuses on delivering reliable operation in demanding vehicular environments.
Soc System On Chip Replacement Considerations
Consult Renesas documentation for officially confirmed substitutes within the R-Car H3 series. Cross-reference pinouts and software compatibility before transitioning to alternative models. Generic replacements are not recommended due to specific automotive certification requirements.
Explore related parts through Embedded, Integrated Circuits (ICs), all product categories, ChipApex homepage.
