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RAA2900014H12HPD#GB2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is MP-3ZK. Review the specifications below when checking this part for your BOM.
The RAA2900014H12HPD#GB2 is a general-purpose intelligent power device (IPD) manufactured by Renesas Electronics Corporation. It operates within an input voltage range of 9 V to 28 V and features a supply current of 708 µA. The component is designed for surface mount installation in a TO-252-3, DPAK (2 Leads + Tab), SC-63 package, also identified as TO-252 (MP-3ZP). It functions reliably across a wide operating temperature range from -20°C to 85°C (TA) with a power dissipation rating of 1.8 W.
Verify the specific suffix GB2 against official Renesas documentation to confirm pinout and thermal characteristics match your design requirements. Ensure the TO-252-3 footprint aligns with your PCB layout guidelines. Confirm active status and lead times directly with authorized distributors or the manufacturer, as availability may vary by region and production batch.
Select this component when a robust, single-channel intelligent power switch is required for 12V or 24V systems. Consider its 1.8 W power dissipation and TO-252 package for adequate thermal management without external heatsinks in moderate duty cycles. Compare supply current and voltage tolerance against similar IPDs if precise low-power standby performance is critical for the target application.
This part belongs to Renesas' intelligent power device portfolio, which combines power MOSFETs with diagnostic and protection circuitry. The MP-3ZK designation indicates a specific configuration within this family. These devices are engineered to replace discrete solutions, offering integrated over-current, over-temperature, and open-load detection for simplified system design.
Consult Renesas datasheets for direct cross-references within the RAA29000 series. Verify that any substitute maintains identical pin compatibility, voltage ratings, and thermal performance specifications to ensure seamless integration without redesigning the host board.
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