SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
RAA2S4251B5HWT#FF0 is listed in the Sensor And Detector Interfaces range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is WAFER UNSAWN. Review the specifications below when checking this part for your BOM.
The RAA2S4251B5HWT#FF0 is an automotive sensor signal conditioner from the Renesas RAA2S425x series. It operates within a supply voltage range of 4.5 V to 5.5 V and supports single-bridge resistive sensor interfaces. The device provides ratiometric analog voltage output alongside digital communication via I2C and ZACwire™ (OWI). It features adjustable analog gain between 3 and 912, with an 18-bit resolution and a maximum sample rate of 10 kHz. Designed for harsh environments, it functions reliably across a temperature range of -40°C to +150°C. The component is housed in a 24-pin QFN package with SMD/SMT termination.
Verify the specific suffix #FF0 against official Renesas documentation to confirm the wafer unsawn gel pack configuration. Ensure compatibility with the target assembly process for uncut wafers. Cross-reference the Mouser part number 968-AA2S4251B5HWTFF0 for accurate identification. Confirm RoHS compliance details directly from the manufacturer's datasheet before finalizing procurement specifications.
Select this component when designing for automotive pressure sensors requiring high accuracy and wide temperature tolerance. The 18-bit resolution and adjustable gain are suitable for demanding measurement tasks. Consider the QFN-24 package dimensions for PCB layout constraints. Verify that the 4.5 V to 5.5 V supply voltage aligns with the system power architecture.
This part belongs to the RAA2S425x family of automotive sensor signal conditioners. It shares core functional characteristics with variants like the RAA2S4251B5HNP#JA0, differing primarily in packaging and suffix designations. The family is designed for xEV and traditional automotive applications, focusing on robust signal processing for bridge-type sensors under strict automotive environmental standards.
The RAA2S4251B5HNP#JA0 is a tape-and-reel variant of the same silicon die. Verify if the change from wafer unsawn to reel-packaged components affects the manufacturing workflow. No other direct substitutes are documented in the provided source material.
Explore related parts through Interface, Integrated Circuits (ICs), all product categories, ChipApex homepage.