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RAA2S4253B5HWT#FF0 is listed in the Sensor And Detector Interfaces range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is WAFER UNSAWN. Review the specifications below when checking this part for your BOM.
The RAA2S4253B5HWT#FF0 is a sensor signal conditioner from the Renesas RAA2S425x series, designed for automotive pressure sensing systems. It complies with ISO 26262 ASIL-B standards. The device operates within a temperature range of -40°C to +150°C and utilizes a QFN-24 package. It is supplied in gel pack packaging with a factory quantity of 4580 units.
Verify the specific suffix #FF0 indicates wafer unsawn status rather than standard packaged ICs. Confirm regional sales availability as distribution channels may restrict shipments. Ensure compliance with export documentation requirements if applicable to the destination region.
Select this component when ASIL-B compliance is mandatory for automotive pressure sensors. Compare against other RAA2S425x variants for interface or pinout differences. Verify that the wafer unsawn form factor aligns with the intended assembly process.
This part belongs to the RAA2S425x family of automotive sensor signal conditioners. Other members include RAA2S4251 and RAA2S4252, which share similar functional architectures but may differ in interfaces or packaging options such as tape and reel or waffle pack configurations.
RAA2S4253B5HWT#AFE (Die on Tray) and RAA2S4253B5HWT#FF1 (Die on Frame) are alternative packaging forms of the same silicon. RAA2S4253B5HNP#JA0 is a QFN-24 packaged version available in tape and reel.
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