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RAA7881762GSU#HB0 is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC TRANSCEIVER FULL 1/1 10MSOP. Review the specifications below when checking this part for your BOM.
The RAA7881762GSU#HB0 is a full-duplex RS-485 transceiver manufactured by Renesas Electronics. It operates with a single 5 V supply voltage and supports data transmission rates up to 10 Mb/s. The device is housed in a 10-lead MSOP package and is rated for an operating temperature range from -40°C to +85°C. This component integrates one driver and one receiver, designed for robust communication in industrial environments while complying with IEC-61000 ESD standards.
Verify the exact part number suffix to confirm packaging type, as variations exist between tape-and-reel and tube formats. Confirm RoHS compliance status through official manufacturer documentation before integration. Ensure the 5 V supply requirement aligns with your system design constraints. Check for moisture sensitivity level requirements during storage and handling procedures.
Select this component when a 5 V supply voltage is required for RS-485 interfaces. Choose this model over lower-speed variants if data rates approaching 10 Mb/s are necessary. Consider the MSOP-10 package dimensions for PCB layout compatibility. Verify that the full-duplex capability matches the specific communication protocol requirements of the target application.
This transceiver belongs to the RAA7881 series of interface ICs from Renesas. The series includes variants with different supply voltages and data rates, such as 3.3 V versions or lower-speed models. The #HB0 suffix typically indicates a specific tape-and-reel packaging configuration for automated assembly processes.
Direct substitutes include other RAA7881 series devices with matching 5 V operation and 10 Mb/s speeds. Cross-reference pinouts and electrical characteristics carefully when considering alternative manufacturers. Ensure any replacement maintains the same MSOP-10 footprint and thermal performance specifications.
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