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RBM24DCWT is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Sullins Connector Solutions. Its product description is CONN EDGE DUAL FMALE 48POS 0.156. Review the specifications below when checking this part for your BOM.
The RBM24DCWT is a card edge connector manufactured by Sullins Connector Solutions, designed for through-hole mounting. It features 48 contacts arranged in two rows with a 0.156-inch (3.96mm) pitch. The connector accommodates dual-edge cards with a thickness of 0.062 inches. Contact material is phosphor bronze with a gold finish of 10.0µin (0.25µm). The insulator is green polyphenylene sulfide (PPS). Operating temperature ranges from -65°C to 125°C. It complies with RoHS and REACH standards.
Verify the specific suffix DCWT against official Sullins documentation to confirm gold plating and right-angle orientation. Ensure compatibility with 0.062-inch PC board thickness. Confirm RoHS compliance status for environmental regulations. Cross-reference the 48-position count with design requirements. Validate operating temperature range against application extremes.
Select this model for applications requiring high-density dual-edge connections with durable gold contacts. Consider the 0.156-inch pitch for standard spacing needs. Evaluate the PPS insulator material for thermal resistance. Assess the through-hole mounting style for mechanical stability. Compare against alternative series if different termination or card thickness is required.
This component belongs to the RBM series of card edge connectors from Sullins Connector Solutions. The series offers various configurations including straight and right-angle options. The RBM24 base indicates a 24-position per row layout. Variations exist for different contact finishes and mounting styles within the same family.
Direct substitutes include RBM24DSUS and RBM24DCAT. Verify pin count, pitch, and termination type before substitution. Ensure mechanical dimensions match the original footprint. Check insulation material compatibility for thermal performance.
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