RBPF-246+

Overview

The RBPF-246+ is a surface-mount lumped LC bandpass filter designed for RF signal conditioning. It operates within a frequency range of 236 MHz to 256 MHz, providing a bandwidth of 29 MHz. The component features a nominal insertion loss of 4 dB and maintains a system impedance of 50 Ohms. Fabricated using SMT technology with high Q construction, it is housed in a compact 16-SMD, no-lead package suitable for automated assembly.

Feature Summary

• Utilizes lumped LC architecture for precise bandpass filtering characteristics
• Constructed with high Q components to ensure effective signal selectivity
• Designed for surface mount technology (SMT) integration

Applications

• RF signal conditioning circuits
• Receiver front-end filtering
• Transmitter output stages

Procurement Notes

Verify the specific datasheet version from Mini-Circuits or authorized distributors to confirm current manufacturing status and exact electrical tolerances. Ensure compatibility with standard SMT reflow profiles during procurement planning. Cross-reference part numbers carefully to distinguish between variants with different suffixes, as these may indicate distinct performance specifications or packaging options.

Selection Notes

Select this component when a fixed center frequency around 246 MHz is required with a narrow 29 MHz bandwidth. The 50 Ohm impedance matches standard RF systems. Consider the 4 dB insertion loss impact on system noise figure. The 16-SMD package size dictates PCB layout constraints compared to larger through-hole alternatives.

Part Context

This model belongs to the RBPF series of lumped element bandpass filters from Mini-Circuits. These components are engineered for applications requiring stable frequency response in compact form factors. The series typically offers various center frequencies and bandwidths to suit diverse RF infrastructure needs.

Replacement Considerations

Consult official substitution guides for equivalent filters with matching center frequencies and bandwidths. Verify that alternative components maintain compatible impedance and package dimensions for direct board replacement.