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RE46C107S16F is listed in the Sensor And Detector Interfaces range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC HORN DRIVER DUAL 16SOIC. Review the specifications below when checking this part for your BOM.
The RE46C107S16F is a CMOS integrated circuit designed for battery-powered applications, combining a DC-to-DC up-converter, voltage regulator, and piezoelectric horn driver. It operates within a supply voltage range of 2.0V to 5.0V and supports an operating temperature range of 0°C to 50°C. The device features a selectable 3.0V or 3.3V regulator output, low quiescent current consumption (typically 14µA in standby), and a 10V boost converter capability. It includes logic inputs for low battery detection, LED driving, and horn enable functions, packaged in a 16-pin SOIC format.
Verify component authenticity by checking manufacturer markings against official datasheet specifications. Confirm package type matches the 16-SOIC form factor and ensure RoHS compliance status aligns with project requirements. Cross-reference ordering suffixes with Microchip documentation to validate packaging and environmental attributes before finalizing procurement orders.
Select this component for designs requiring a combined power management and acoustic driver solution in compact spaces. Ensure external components, such as the boost inductor and Schottky diode, meet the specified peak current ratings and resistance limits to maintain efficiency. Verify that the system's logic levels are compatible with the Vreg-supplied input thresholds for reliable operation.
This part belongs to the RE46C107 family from R&E International, a subsidiary of Microchip Technology. The 'S16F' suffix indicates a surface-mount 16-pin SOIC package with specific lead-free/RoHS compliant packaging. Other variants in the series include through-hole PDIP options like the RE46C107E16F, offering flexibility for different manufacturing processes.
Direct substitutes within the same family include the RE46C107S16TF, which shares identical electrical characteristics but utilizes tape-and-reel packaging instead of tubes. Designers should verify that any alternative package variant maintains the same pinout and thermal performance to ensure seamless integration without PCB redesign.
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