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Product Detailed Parameters
- Description：IC VREF SERIES 0.15% DIE
- Series：-
- Mfr：Texas Instruments
- Package：Tube
- Output Type：Fixed
- Voltage - Output (Min/Fixed)：2.5V
- Voltage - Output (Max)：-
- Current - Output：5 mA
- Operating Temperature：-
- Mounting Type：-
- Package / Case：Die
- Supplier Device Package：Die
- Grade：-
- Qualification：-
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Overview
The REF3325ATDD1 is a fixed 2.5V series voltage reference IC provided as a bare die by Texas Instruments. It features an initial accuracy of ±0.15% and a temperature coefficient of 30 ppm/°C. The device operates within an input voltage range of 2.7V to 5.5V and supports a maximum load current of 5 mA. It functions across an extended temperature range from -40°C to +125°C.
Feature Summary
- Provides a stable 2.5V output with high precision for analog circuits
- Low temperature drift ensures consistent performance over wide thermal ranges
- Supports significant load currents for driving downstream components
Applications
- Precision data acquisition systems requiring stable reference voltages
- High-resolution analog-to-digital converter (ADC) references
- Industrial process control instrumentation
- Medical equipment signal conditioning circuits
Procurement Notes
Verify that the procurement specification explicitly requires a bare die form factor, as this component lacks a standard package. Confirm compatibility with flip-chip or wire-bond assembly processes during design-in. Ensure handling protocols account for the absence of protective casing to prevent electrostatic discharge damage during manufacturing integration.
Selection Notes
Select this part when board space constraints necessitate a bare die solution rather than a packaged IC. It is suitable for applications requiring 2.5V stability with ±0.15% accuracy. Consider the additional PCB area required for die attachment and wire bonding infrastructure compared to surface-mount packages like SOT-23 or UQFN.
Part Context
This component belongs to the REF3325 family of low-drift voltage references manufactured by Texas Instruments. The family includes packaged variants such as the REF3325AIDBZR in SOT-23-3 and the REF3325AIRSER in UQFN-8. The ATDD1 suffix specifically denotes the unpackage die version intended for custom substrate integration.
Replacement Considerations
Direct functional equivalents include other packaged versions of the same silicon, such as REF3325AIDCKR or REF3325AIRSER. These offer identical electrical characteristics but require different footprint designs and assembly methods due to their surface-mount packaging.
