REF3325ATDD2

Overview

The REF3325ATDD2 is a fixed series voltage reference IC manufactured by Texas Instruments, provided as a bare die. It delivers a fixed output voltage of 2.5V with an initial accuracy of ±0.15%. The device features a temperature coefficient of 30 ppm/°C and supports a maximum input voltage of 5.5V. It can source up to 5 mA of load current while maintaining low noise characteristics. The component operates within a temperature range of -40°C to +125°C.

Feature Summary

• Provides a stable 2.5V fixed output voltage suitable for precision analog circuits
• Ensures high long-term stability and low drift over temperature variations
• Capable of sourcing significant load current for driving downstream components

Applications

• Precision data acquisition systems requiring stable reference voltages
• Analog-to-digital converter (ADC) reference inputs
• Digital-to-analog converter (DAC) reference sources
• Battery-powered instrumentation utilizing low-power references

Procurement Notes

Verify the specific die marking and wafer lot information upon receipt, as bare die components lack standard packaging identifiers. Confirm compatibility with your flip-chip or wire-bond assembly processes. Ensure proper handling procedures are followed to prevent electrostatic discharge damage to the exposed silicon die during integration into your printed circuit board design.

Selection Notes

Select this part when space constraints preclude standard packages like SOT-23 or UQFN. Consider the additional engineering effort required for die attachment and wire bonding compared to packaged equivalents. Evaluate thermal management strategies for the substrate, as heat dissipation differs from traditional surface-mount packages. Verify that the 5.5V maximum input rating aligns with your system's supply rails.

Part Context

This component belongs to the REF3325 family of low-drift voltage references from Texas Instruments. While packaged versions such as the REF3325AIDBZR utilize SOT-23-3 or UQFN-8 housings, the ATDD2 variant represents the raw semiconductor die. This form factor allows for custom module integration where footprint reduction is critical, offering the same electrical performance as its packaged counterparts without the physical package dimensions.

Replacement Considerations

Direct functional substitutes include other packaged variants within the REF3325 family, such as REF3325AIDCKR or REF3325AIRSER, provided the application can accommodate their respective package sizes. Ensure any replacement maintains the 2.5V output and ±0.15% accuracy requirements.