REF5025SKGD1

Overview

The REF5025SKGD1 is a voltage reference die from Texas Instruments, part of the REF5025 series. It provides a fixed output voltage of 2.5 V with an initial accuracy tolerance of ±0.9%. The device operates within an input voltage range of 3.25 V to 18 V and supports a maximum shunt current of 7 mA. Designed for surface-mount integration, this bare die component requires external packaging by the system integrator.

Feature Summary

• Fixed 2.5 V precision output voltage
• ±0.9% initial accuracy tolerance
• Low noise performance specification
• Very low drift characteristics

Applications

• Precision analog-to-digital converter (ADC) references
• Data acquisition systems requiring stable voltage sources
• Industrial process control instrumentation
• Medical equipment signal conditioning

Procurement Notes

Verify that the procurement source explicitly identifies the component as a bare die or tape-and-reel substrate rather than a packaged IC. Confirm the suffix 'D1' corresponds to the specific die configuration. Ensure handling procedures account for the lack of standard package protection during assembly.

Selection Notes

Select this component when system design allows for custom packaging of voltage reference dies. Compare the ±0.9% accuracy against higher-precision family members like the REF5025EIDR if tighter tolerances are required. Evaluate thermal management requirements suitable for die-level mounting on the PCB substrate.

Part Context

This component belongs to the Texas Instruments REF5025 series of low-noise, very low drift precision voltage references. Unlike packaged variants such as the REF5025MDTEP in SOIC-8, the SKGD1 designation indicates a die format intended for direct integration into advanced packaging solutions or hybrid circuits by the end manufacturer.

Replacement Considerations

For packaged equivalents, consider the REF5025MDTEP for standard SOIC-8 applications or the REF5025EIDR for enhanced accuracy specifications. Direct die-to-die substitution is not feasible without redesigning the physical mounting and interconnect infrastructure.