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RFANT5220110A2T is listed in the Antennas RF range at ChipApex. The manufacturer field lists Walsin Technology Corporation. Its product description is RF ANT 2.4GHZ CHIP SOLDER SMD. Review the specifications below when checking this part for your BOM.
The RFANT5220110A2T is a passive ceramic PCB antenna manufactured by Walsin Technology Corporation. Designed for surface mount applications, it supports Bluetooth and WLAN protocols including 802.11 a/b/g standards. The component operates across multiple frequency bands with center frequencies at 2.4 GHz, 4.9 GHz, and 5.8 GHz. It features a chip mechanical form factor with dimensions of 5.2 mm in length, 2.0 mm in width, and 1.1 mm in height. The antenna provides gains of 1.5 dBi, 4 dBi, and 4 dBi respectively, with an impedance of 50 Ohms and a VSWR of 2.
Verify the specific datasheet version to confirm current RoHS compliance status and detailed electrical tolerances. Ensure that the receiving facility has appropriate ESD protection measures during handling. Confirm that the PCB layout matches the recommended footprint specifications provided in the official documentation to maintain signal integrity and proper impedance matching.
Select this component when space-constrained designs require integrated support for both Bluetooth and Wi-Fi connectivity. The 5.2x2.0 mm package size offers a small footprint suitable for portable electronics. Consider the specific gain requirements for each band to ensure adequate coverage for the intended application environment without requiring external amplification.
This part belongs to the RFANT series of passive antennas from Walsin Technology Corporation. The series includes various models tailored for different wireless standards and physical dimensions. These components are engineered for use in mobile communications and networking applications where compact, reliable RF transmission is required.
The RFANT5220110A0T is listed as an industry-standard alternative within the same product family. Verify dimensional compatibility and electrical parameter alignment before substitution.
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