RFBLN16080G9D3T

Balun Overview

The RFBLN16080G9D3T is an RF and wireless balun manufactured by Walsin Technology Corporation, designed for RF applications in wireless communication systems. It operates within a frequency range of 824MHz to 894MHz, suitable for GSM band applications. The component features a 50/50 Ohm unbalanced/balanced impedance configuration with a phase difference of 180° ±10°. Maximum insertion loss is specified at 1.2dB. It is housed in a compact 0603 (1608 Metric) package with a 6-pad configuration.

Balun Feature Summary

• Provides balanced-to-unbalanced signal conversion for RF circuits
• Optimized for GSM band frequency operations
• Compact surface-mount design for space-constrained PCB layouts

Balun Applications

• GSM band wireless communication systems
• RF front-end modules
• Mobile device antenna interfaces

Balun Procurement Notes

Verify the manufacturer part number against official Walsin Technology documentation to ensure authenticity. Confirm that the received components match the specified 0603 package dimensions and electrical characteristics. Check for any specific handling requirements during storage and assembly to maintain performance integrity.

Balun Selection Notes

Select this component when a balun is required for GSM band frequencies between 824MHz and 894MHz. Ensure the design accommodates the 50 Ohm impedance matching and the physical footprint of the 0603 package. Consider the insertion loss specification relative to system sensitivity requirements.

Balun Part Context

This balun belongs to Walsin Technology's RF and wireless component portfolio, specifically targeting applications requiring signal balancing in the GSM spectrum. It serves as a critical interface element in modern wireless devices, facilitating efficient signal transmission and reception within defined frequency bands.

Balun Replacement Considerations

The RFBLN20120G9D4T is a related model from the same manufacturer family, also intended for GSM band applications. Verify compatibility regarding package size and electrical parameters before substitution.