RFBPF20123G7W2T

Overview

The RFBPF20123G7W2T is a multilayer ceramic band pass RF filter manufactured by Walsin Technology Corporation. It features a center frequency of 3.75GHz and a bandwidth of 900MHz. The component exhibits an insertion loss of 2dB. It utilizes a surface mount package in the 0805 (2012 Metric) footprint with three PC pads. Physical dimensions are 2.00mm in length and 1.25mm in width.

Feature Summary

• Multilayer ceramic construction for reliable RF signal filtering
• Designed to pass frequencies within the specified 900MHz bandwidth range
• Surface mount configuration suitable for automated assembly processes

Applications

• Wireless communication systems requiring specific frequency selection
• RF front-end modules in consumer electronics
• Signal processing circuits operating near 3.75GHz

Procurement Notes

Verify the exact part number against official Walsin Technology Corporation documentation to ensure compatibility with design specifications. Confirm that the 0805 package dimensions and electrical parameters match the target circuit requirements before integration. Cross-reference datasheets for any updates regarding RoHS compliance or manufacturing changes.

Selection Notes

Select this component when a band pass filter with a 3.75GHz center frequency and 900MHz bandwidth is required. Ensure the application supports the 2dB insertion loss characteristic. The 0805 surface mount package must fit the available PCB real estate. Verify impedance matching and thermal constraints for the specific environment.

Part Context

This component belongs to the RFBPF series of multilayer ceramic band pass filters from Walsin Technology Corporation. The series provides passive RF filtering solutions designed for high-frequency applications. These filters are engineered to meet the demands of modern electronic devices requiring precise frequency control and signal integrity.

Replacement Considerations

Consult official Walsin Technology Corporation substitution guides for verified alternatives. Ensure any replacement maintains identical center frequency, bandwidth, and package dimensions. Verify that alternative components meet the same insertion loss specifications and physical footprint requirements.