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RFDIP1608060L3T is listed in the RF Multiplexers range at ChipApex. The manufacturer field lists Walsin Technology Corporation. Its product description is RF DIPLEXER 2.45GHZ/5.4GHZ 0603. Review the specifications below when checking this part for your BOM.
The RFDIP1608060L3T is a multilayer ceramic diplexer manufactured by Walsin Technology Corporation. It operates at frequencies of 2.4 GHz and 5 GHz with a nominal impedance of 50 Ohms. The component utilizes Low-Temperature Co-fired Ceramic (LTCC) technology to achieve low insertion loss, specified as 0.8 dB and 1.2 dB for its respective bands. It features suppressed high attenuation on the second harmonic. The device is housed in a surface-mount 0603 package, measuring 1.60mm x 0.80mm with a maximum height of 0.70mm.
Verify the specific insertion loss values and frequency response curves against the official manufacturer datasheet before integration. Confirm that the 0603 footprint dimensions align with the PCB layout requirements. Ensure compatibility with standard reflow soldering profiles for LTCC components. Check for RoHS compliance status if required by project specifications.
Select this component when compact size and dual-band filtering are required for wireless applications. The 0603 package offers space efficiency compared to larger alternatives. Consider the specific insertion loss characteristics of 0.8 dB and 1.2 dB to ensure they meet system sensitivity requirements. Evaluate the second harmonic suppression capabilities for interference mitigation needs.
This part belongs to the RFDIP series of multilayer ceramic diplexers from Walsin Technology Corporation. These components are designed for signal conditioning in RF circuits. The series utilizes LTCC manufacturing processes to deliver reliable performance in consumer electronics and telecommunications equipment. The product line focuses on miniaturization and high-frequency stability.
Public confirmed substitute part numbers are not available in the provided documentation. Verify functional equivalence regarding frequency ranges, impedance, and package dimensions if sourcing alternatives.
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