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RH100-25.000-18-F-2020-X-T-NS1 is listed in the Crystals range at ChipApex. The manufacturer field lists Raltron Electronics. Its product description is CRYSTAL 25.0000MHZ 18PF SMD. Review the specifications below when checking this part for your BOM.
The RH100-25.000-18-F-2020-X-T-NS1 is a 25 MHz surface-mount crystal oscillator manufactured by Raltron Electronics. It operates in fundamental mode with a load capacitance of 18 pF and an equivalent series resistance (ESR) of 40 Ohms. The device features a frequency tolerance of ±20 ppm at 25°C and is housed in a 4-SMD, no lead package. This component is designed for microprocessor clock applications, providing stable timing signals for digital circuits.
Verify the specific datasheet for the exact suffix configuration, as variations in the RH100 series may indicate differences in temperature range or aging rates. Confirm that the 40 Ohm ESR aligns with the target microcontroller's drive level requirements to prevent over-driving or failure to start. Ensure the 18 pF load capacitance matches the system's PCB layout parasitic capacitance for accurate frequency tuning.
Select this component when a 25 MHz reference is required for standard industrial or commercial applications. The 40 Ohm ESR suggests suitability for low-power microcontrollers. Designers should account for the ±20 ppm initial tolerance in system timing budgets. Verify that the operating temperature range meets the final product's environmental specifications, as general RH100 models vary between commercial and extended industrial grades.
This part belongs to the Raltron RH100 series of surface-mount crystals. The series offers various frequencies and封装 sizes tailored for embedded systems. The RH100 line is characterized by consistent performance across manufacturing batches, making it a common choice for mass-produced electronic devices requiring precise clock references.
Direct substitutes must match the 25 MHz frequency, 18 pF load capacitance, and 40 Ohm ESR. Check competitor packages for identical footprint dimensions to ensure compatibility with existing PCB silkscreens and solder masks. Verify that alternative components support the same drive level constraints.
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