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The RLP-105+ is a lumped LC low-pass filter manufactured by Mini-Circuits, designed for signal conditioning applications. It operates within a frequency range of DC to 105 MHz and features a characteristic impedance of 50 Ohms. The component utilizes surface-mount technology with an eight-SMD, no-lead package configuration. Key electrical specifications include a cutoff frequency of approximately 116 MHz and an insertion loss of 1.3 dB. The device is rated for operation between -40°C and +85°C, ensuring reliability in various environmental conditions while maintaining signal integrity through effective high-frequency attenuation.
Verify the exact ordering suffix (+) indicates RoHS compliance when sourcing. Confirm the specific case style GP78 or similar variant matches your PCB footprint requirements. Ensure the surface-mount package type aligns with your assembly capabilities. Cross-reference the datasheet revision date to guarantee parameter accuracy. Validate availability through authorized distributors due to potential supply chain fluctuations.
Choose this component for applications requiring precise low-pass filtering below 105 MHz. The 50 Ohm impedance suits standard RF transmission lines. Consider the surface-mount form factor for automated assembly processes. Evaluate the insertion loss specification against system noise budget requirements. Ensure the operating temperature range meets the environmental constraints of the final application.
This part belongs to the Mini-Circuits RLP series of lumped element filters. These components are engineered for cost-effective signal processing in RF and IF bands. The series offers various cutoff frequencies to suit different bandwidth needs. The RLP-105+ specifically targets applications needing sharp roll-off characteristics near 100 MHz. It complements other Mini-Circuits passive components in complete filter designs.
ZX75LP-105-S+ is a coaxial alternative from the same manufacturer family. Verify interface compatibility as the replacement uses SMA connectors instead of surface mount. Check if the physical dimensions fit the existing enclosure design. Assess whether the connectorized version meets space constraints compared to the SMD original.