RLP-190+

Overview

The RLP-190+ is a surface-mount low-pass filter from Mini-Circuits designed for signal conditioning applications. It operates within a frequency range of 0 Hz to 190 MHz and features a nominal impedance of 50 Ohms. The component utilizes SMD/SMT termination styles and is housed in an 8.89 mm x 8.89 mm x 2.54 mm package. It exhibits an insertion loss of 0.95 dB and functions reliably within an operating temperature range of -40°C to +85°C.

Feature Summary

• Surface-mount construction for automated board assembly
• Low-pass filtering capability up to 190 MHz
• 50 Ohm system impedance compatibility
• RoHS compliant manufacturing

Applications

• VHF band signal processing
• RF signal conditioning circuits
• General-purpose low-pass filtering in electronic systems

Procurement Notes

Verify the specific datasheet version and RoHS status directly with Mini-Circuits or authorized distributors before integration. Confirm that the 8.89 mm x 8.89 mm x 2.54 mm package dimensions align with your PCB footprint requirements. Ensure the operating temperature range of -40°C to +85°C meets your environmental specifications. Cross-reference the 0.95 dB insertion loss parameter against your system's power budget constraints.

Selection Notes

Select this component when a compact, surface-mount solution is required for frequencies up to 190 MHz. The 50 Ohm impedance makes it suitable for standard RF transmission lines. Consider the physical size of 8.89 mm x 8.89 mm for space-constrained designs. Verify thermal performance within the specified -40°C to +85°C range for your specific application environment.

Part Context

This part belongs to the RLP series of low-pass filters manufactured by Mini-Circuits. The series focuses on signal conditioning components utilizing surface-mount technology. These filters are engineered for RF and microwave applications requiring precise frequency control and minimal signal degradation within the passband.

Replacement Considerations

Consult Mini-Circuits official documentation for verified substitute part numbers within the RLP series or equivalent product lines. Do not assume functional equivalence based solely on cutoff frequency; verify impedance, package dimensions, and electrical specifications against the original design requirements.