RLP-40+

Overview

The RLP-40+ is a lumped element LC low-pass filter manufactured by Mini-Circuits. It provides signal conditioning with a cutoff frequency of 56 MHz and operates within a DC to 40 MHz passband. The component features a 50 Ohm impedance and utilizes surface mount technology (SMD/SMT) for integration into circuit boards. It is housed in an 8-SMD, no lead package measuring 8.89 mm x 8.89 mm x 2.54 mm. The device supports operation at minimum temperatures of -40 C.

Feature Summary

• Provides low-pass filtering functionality using lumped LC architecture
• Designed for surface mount integration on printed circuit boards
• Maintains standard 50 Ohm system impedance

Applications

• RF signal conditioning circuits
• Harmonic suppression in RF systems
• Base station front-end filtering

Procurement Notes

Verify the specific part number suffix against official Mini-Circuits documentation to confirm exact electrical specifications and packaging details. Ensure compatibility with existing PCB footprint dimensions and thermal requirements. Confirm RoHS compliance status if required by project regulations. Cross-reference datasheet revisions to ensure alignment with current manufacturing standards.

Selection Notes

Select this component when a sharp cutoff near 56 MHz is required for low-frequency RF applications. Consider the physical dimensions of the 8-SMD package for board space constraints. Evaluate the temperature range suitability for the intended operating environment. Compare performance metrics against alternative filters if higher frequency ranges are needed.

Part Context

This component belongs to the Mini-Circuits RLP series of lumped element low-pass filters. These components are designed for general-purpose RF applications requiring reliable signal filtering from DC up to specified cutoff frequencies. The series offers compact SMD solutions for integrating passive filtering into modern electronic designs.

Replacement Considerations

Consult Mini-Circuits official substitution guides for verified equivalent parts. Verify that any substitute maintains identical impedance, package size, and cutoff frequency characteristics to ensure circuit compatibility.