SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
RMPA2059 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is IC AMP W-CDMA 1.92-1.98GHZ 11LCC. Review the specifications below when checking this part for your BOM.
The RMPA2059 is a W-CDMA PowerEdge power amplifier module manufactured by Fairchild Semiconductor. It operates within the frequency range of 1.92GHz to 1.98GHz, designed for wireless communication applications. The device provides a gain of 26dB with an associated noise figure of 3dB. It requires a supply voltage between 3.1V and 4.5V and draws a supply current of 80mA. The component is available in a surface mount Tape & Reel packaging format.
Verify component authenticity through authorized distribution channels due to potential availability from secondary markets. Confirm RoHS compliance status and specific manufacturing lot dates against project requirements. Ensure storage conditions maintain integrity prior to installation. Review datasheet revisions for any parameter updates affecting system compatibility.
Evaluate thermal management capabilities as the module dissipates heat during high-power operation. Compare electrical specifications against system impedance matching requirements to ensure optimal signal transfer. Consider physical dimensions and pin configuration for PCB layout constraints. Assess supply chain reliability given the manufacturer's history regarding this specific product line.
Fairchild Semiconductor developed this amplifier module for the telecommunications sector, specifically targeting third-generation mobile networks. The company specialized in power electronics and analog processing solutions before its acquisition by onsemi. This part represents the legacy portfolio of RF components designed for robust wireless infrastructure deployment.
Consult official cross-reference documentation for direct substitutes. Verify that alternative components match the 1.92GHz-1.98GHz frequency range and 26dB gain specification. Ensure package compatibility and pinout alignment to prevent redesign efforts.
Explore related parts through RF and Wireless, all product categories, ChipApex homepage.