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The RN4907FE,LXHF(CT is a pre-biased dual transistor array manufactured by Toshiba Semiconductor and Storage. It integrates one NPN and one PNP bipolar junction transistor within a single US6 surface-mount package. The device features built-in bias resistors, with R1 specified at 10 kΩ and R2 at 47 kΩ. Key electrical ratings include a maximum collector-emitter voltage of 50V, a continuous collector current of 100mA, and a transition frequency of 200MHz. The unit supports a maximum power dissipation of 200mW and maintains a minimum DC current gain (hFE) of 80 at 10mA and 5V.
Verify the specific suffix LXHF against the manufacturer's latest documentation to confirm automotive qualification status and RoHS compliance details. Ensure the ordering code matches the required packaging format, as variations exist between tape-and-reel and cut-tape options. Cross-reference the part number with official Toshiba Semiconductor and Storage databases to validate current production status and availability before finalizing procurement plans.
Select this component when a matched NPN/PNP pair with fixed bias ratios is required in a minimal footprint. The 10kΩ/47kΩ resistor configuration offers specific drive characteristics distinct from other variants like the RN4901 or RN4905. Confirm that the 50V voltage rating and 100mA current limit align with the target application's operational parameters and thermal constraints.
This part belongs to the Toshiba RN49xx series of digital transistors, which are designed to simplify circuit layouts by replacing discrete transistors and base resistors. The FE suffix typically denotes automotive-grade qualification under AEC-Q101 standards, while the LXHF suffix indicates specific environmental and packaging attributes defined by the manufacturer.
Direct substitutes within the same family include RN4907,LF for standard industrial use. For automotive applications requiring similar electrical characteristics but different packaging, consider the RN4907FE,TPL3,F variant. Verify pin compatibility and thermal performance when transitioning between package types such as US6 and ES6.