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RS31387R is listed in the Hot Swap Controllers range at ChipApex. The manufacturer field lists Reed Semiconductor Corp.. Its product description is IC ELECTRONIC FUSE 32LGA. Review the specifications below when checking this part for your BOM.
The RS31387R is a stackable 50A eFuse with hot swap protection and current monitoring. It features a wide input voltage range of 4V to 16V and an integrated 1mΩ pass MOSFET. The device provides accurate current monitoring with ±1% precision at 25°C and includes adjustable output soft start time. Packaged in a 32-LGA (5x5) format, it supports parallel operation for higher current applications.
Verify the specific suffix 'R' corresponds to the tape-and-reel packaging configuration as indicated by distributor listings. Confirm that the 32-LGA package dimensions align with your PCB footprint requirements. Ensure compatibility with the 4V to 16V input voltage range for your system design. Check for RoHS compliance status if required by your manufacturing standards.
Select this component when high-current protection up to 50A is required with precise current monitoring capabilities. The stackable architecture allows for scaling current capacity by paralleling multiple units. Consider the 1mΩ on-resistance for thermal management planning. The adjustable soft start feature is critical for managing inrush currents in sensitive motherboard or server applications.
The RS31387R belongs to Reed Semiconductor's family of active circuit protection devices designed for industrial and computing applications. It serves as a robust alternative to traditional fuses and basic PTCs, offering resettable protection with advanced monitoring features. The device integrates a MOSFET switch to actively limit fault currents and voltages, ensuring system safety during abnormal conditions.
The RS31385R is a comparable 50A eFuse from the same manufacturer but utilizes a 0.8mΩ pass MOSFET and may differ in specific electrical characteristics or pinout configurations. Verify functional equivalence before substitution, particularly regarding the on-resistance value and package type differences between the LGA variants.
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