RSP-237709-03

Overview

The RSP-237709-03 is a side card connector receptacle manufactured by Samtec Inc. It belongs to the Generate® series of high-speed interconnect solutions designed for demanding data communication and industrial applications. This component utilizes Edge Rate® contact technology to ensure signal integrity in high-frequency environments. The system supports differential pair configurations with a 0.60 mm pitch, enabling performance up to 64 Gbps PAM4 (32 Gbps NRZ). It is engineered to support PCIe® 6.0 and CXL® 3.2 standards while complying with SFF-TA-1002 specifications for x4, x8, and x16 form factors.

Feature Summary

• Edge Rate® contacts optimized for signal integrity in high-speed differential pairs
• Supports 64 Gbps PAM4 and 32 Gbps NRZ data rates
• Compliant with SFF-TA-1002 specifications for edge card systems
• Enables PCIe® 6.0 and CXL® 3.2 capability

Applications

• Data communication infrastructure
• Industrial control systems
• High-performance computing platforms
• PCI Express® expansion slots

Procurement Notes

Verify the specific suffix codes on the component label against official Samtec documentation to confirm pin count, orientation, and termination style. Ensure that the selected variant matches the required stack height and mating cable interface. Cross-reference the part number with the latest datasheet to confirm compliance with current environmental regulations and material specifications before finalizing procurement orders.

Selection Notes

Select this component when designing systems requiring 0.60 mm pitch side card connections with high-speed data transmission capabilities. Consider the mechanical constraints of the card slot thickness and the need for robust signal integrity at frequencies exceeding 32 Gbps. Evaluate the available options for board locks and latching mechanisms if additional mechanical stability is required for the specific application environment.

Part Context

This part is part of Samtec's Generate® portfolio, which focuses on high-density, high-speed interconnect solutions. The series offers various spacing options and design configurations to support evolving industry standards. The RSP-237709-03 specifically addresses the need for reliable connectivity in next-generation computing architectures where bandwidth requirements are rapidly increasing.

Replacement Considerations

Consult official Samtec substitution guides for verified alternative part numbers within the same product family. Ensure that any substitute maintains the 0.60 mm pitch and compatible mating interface. Verify that the replacement meets the same electrical performance criteria and mechanical fitment requirements as the original component.