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RX3L18BBGC16 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is NCH 60V 180A, TO-220AB, POWER MO. Review the specifications below when checking this part for your BOM.
The RX3L18BBGC16 is a single N-channel power MOSFET manufactured by ROHM Semiconductor, utilizing silicon technology. It features a TO-220AB-3 through-hole package with three terminals. Key electrical parameters include a drain-source voltage (Vds) of 60 V and a continuous drain current (Id) of 240 A. The device exhibits a typical on-resistance (Rds(on)) of 1.84 mΩ at a gate-source voltage of 4.5 V. Additional specifications comprise a gate-source voltage range of ±20 V, a threshold voltage of 2.5 V, and a total gate charge of 160 nC. Power dissipation is rated at 192 W, with an operating temperature range from -55°C to +150°C.
Verify the specific ordering suffix and RoHS compliance status directly against the manufacturer's latest datasheet before procurement. Confirm that the component meets all required thermal and electrical specifications for the intended application environment. Ensure that sourcing channels provide authentic products with traceable documentation to guarantee reliability and performance consistency.
Select this component when a 60 V N-channel MOSFET with high current capacity is required in a TO-220AB package. Consider the 1.84 mΩ on-resistance for conduction loss calculations at 4.5 V drive. Evaluate thermal management requirements based on the 192 W power dissipation rating and the specified junction temperature limits for reliable long-term operation.
This part belongs to the RX3L series of N-channel power MOSFETs from ROHM Semiconductor. The series is characterized by low on-resistance and robust packaging options designed for switching applications. The RX3L18BBGC16 specifically denotes the variant with the GC16 suffix, indicating particular manufacturing or compliance attributes within the broader product line.
The RX3L18BBG is listed as a similar level replacement with the same pinout and package. Verify functional equivalence and parameter alignment before substitution.
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