RXM-900-HP3-SPS

RF Receivers Overview

The RXM-900-HP3-SPS is a Sub-GHz RF receiver module manufactured by TE Connectivity Linx. It operates within the 902 MHz to 928 MHz frequency range, supporting FSK and FM modulation schemes. The device features a sensitivity of -100 dBm and supports data rates up to 56 kbps. Designed for through-hole mounting in an 18-SIP package, it functions with a supply voltage between 2.7 V and 3.6 V across an operating temperature range of -40°C to +85°C.

RF Receivers Feature Summary

• Supports FSK and FM modulation protocols
• Through-hole SIP packaging design
• High sensitivity reception capability

RF Receivers Applications

• Industrial telemetry systems
• Remote monitoring applications
• Wireless sensor networks

RF Receivers Procurement Notes

Verify current availability status as this component may be subject to discontinuation or limited supply conditions. Confirm that the specific through-hole 18-SIP package aligns with your PCB layout requirements. Ensure the host system provides the necessary voltage regulation within the specified 2.7 V to 3.6 V range. Validate that the required data rate does not exceed 56 kbps for reliable operation.

RF Receivers Selection Notes

Select this module when a robust through-hole solution is preferred over surface-mount alternatives for mechanical stability. Consider the 18-SIP form factor if automated insertion equipment is available. Evaluate the -100 dBm sensitivity against link budget requirements. Verify compatibility with existing FSK or FM demodulation infrastructure before finalizing the design.

RF Receivers Part Context

This part belongs to the HP3 series of RF receivers from TE Connectivity Linx, designed for sub-GHz ISM band applications. It complements other modules like the RXM-900-HP3-PPS but differs in its through-hole SIP packaging versus surface mount options. The series targets industrial environments requiring reliable wireless data transmission.

RF Receivers Replacement Considerations

The RXM-900-HP3-PPS serves as a functional alternative offering similar electrical specifications but utilizes a surface-mount package instead of through-hole. Designers must adapt their PCB footprints accordingly when switching between these variants.