S25FL128LAGBHI020

Memory IC Overview

The S25FL128LAGBHI020 is a 128 Mbit NOR flash memory component manufactured by Infineon Technologies, part of the S25FL128L series. It features a BGA-24 package and supports standard SPI interface with a maximum clock frequency of 133 MHz. The device operates within a voltage range of 2.7 V to 3.6 V and has an active read current of up to 100 mA. Memory organization is 16 M x 8 bits. It is qualified under AEC-Q100 standards for automotive applications and functions reliably in temperatures from -40°C to +105°C.

Memory IC Feature Summary

• AEC-Q100 qualified for automotive reliability
• High-speed synchronous SPI interface
• Extended industrial temperature range operation

Memory IC Applications

• Automotive infotainment systems
• Telematics control units
• Industrial embedded storage

Memory IC Procurement Notes

Verify the manufacturer designation carefully, as Infineon acquired Cypress Semiconductor's memory business. Ensure the specific suffix matches the required package and temperature grade. Confirm RoHS compliance status through official documentation before integration into production designs.

Memory IC Selection Notes

Select this component when automotive qualification and high-temperature stability are required. The BGA-24 package suits space-constrained PCB layouts. Verify that the system power supply remains within the 2.7 V to 3.6 V operating window to ensure data integrity and proper interface timing.

Memory IC Part Context

This part belongs to the S25FL128L family of NOR flash memories. The 'L' variant typically denotes low-voltage operation and extended temperature ranges compared to standard variants. The BGA package provides compact footprint advantages for modern electronic assemblies requiring robust non-volatile storage solutions.

Memory IC Replacement Considerations

Direct substitutes include other S25FL128L variants with compatible pinouts and electrical characteristics. Cross-reference package dimensions and thermal specifications to ensure mechanical compatibility during board redesigns or supply chain adjustments.