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S25FL132K0XMFIS10Z is listed in the Memory IC range at ChipApex. The manufacturer field lists Spansion. Its product description is IC FLASH 32MBIT SPI/QUAD 8SOIC. Review the specifications below when checking this part for your BOM.
Memory IC specifications for S25FL132K0XMFIS10Z
- Description：IC FLASH 32MBIT SPI/QUAD 8SOIC
- Series：FL1-K
- Mfr：Spansion
- Package：Bulk
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：32Mbit
- Memory Organization：4M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：108 MHz
- Write Cycle Time - Word, Page：3ms
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-SOIC (0.209", 5.30mm Width)
- Supplier Device Package：8-SOIC
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for S25FL132K0XMFIS10Z
Memory IC Overview
The S25FL132K0XMFIS10Z is a 32 Mbit (4M x 8) NOR Flash memory IC manufactured by Spansion. It utilizes SPI Quad I/O interface with a clock frequency of 108 MHz. The device operates within a voltage range of 2.7V to 3.6V and supports surface mount installation in an 8-SOIC package. It features non-volatile storage technology, a page write cycle time of 3ms, and functions reliably across an operating temperature range of -40°C to 85°C.
Memory IC Feature Summary
- Supports high-speed serial communication via SPI Quad I/O interface
- Provides non-volatile data retention for persistent storage applications
- Operates within standard industrial temperature ranges
Memory IC Applications
- Consumer electronics devices requiring code storage
- Network equipment firmware storage
- Industrial control system programming
Memory IC Procurement Notes
Verify the specific suffix 'S10Z' against official Spansion documentation to confirm the 8-SOIC package configuration. Ensure compatibility with existing board layouts designed for this footprint. Confirm RoHS3 compliance status through current manufacturer declarations before finalizing procurement decisions.
Memory IC Selection Notes
Select this component when a small form factor is required alongside 32 Mbit capacity. The 8-SOIC package offers space efficiency compared to larger BGA options. Verify that the host controller supports the necessary SPI modes and voltage levels for reliable operation within the specified electrical parameters.
Memory IC Part Context
This part belongs to the Spansion FL1-K series of NOR Flash memories. It shares architectural similarities with other models in the family but differs in package type and pinout. The S25FL132K0XMFIS10Z specifically targets applications where compact surface-mount solutions are preferred over larger ball grid array packages.
Memory IC Replacement Considerations
Cross-reference with S25FL132K0XBHI030 if BGA packaging is acceptable. Verify pin-to-pin compatibility with other S25FL132K variants featuring SOIC packages before substitution.
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