SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
S25FL256SDSMFV011 is listed in the Memory IC range at ChipApex. The manufacturer field lists Spansion. Its product description is IC FLASH 256MBIT SPI/QUAD 16SOIC. Review the specifications below when checking this part for your BOM.
The S25FL256SDSMFV011 is a 256 Mbit (32 Mbyte) MirrorBit Flash non-volatile memory device manufactured by Spansion, now part of Infineon Technologies. It utilizes a CMOS 3.0 Volt core and connects via a Serial Peripheral Interface (SPI) supporting Multi-I/O data transfer modes. The component operates within a supply voltage range of 2.7 V to 3.6 V and supports maximum clock frequencies up to 80 MHz in standard SPI mode. It is housed in a 16-pin SOIC package with a narrow body configuration.
Verify the specific suffix 'V011' against official Infineon documentation, as public records predominantly list 'V013' for the reel-packaged variant of this series. Confirm that the requested part number corresponds to the correct tape-and-reel packaging format and ensure compatibility with the required operating temperature range before finalizing procurement orders.
Select this component when a 256 Mbit capacity is required with a 16-pin surface-mount footprint. Ensure the design supports the 2.7 V to 3.6 V supply voltage range. Verify that the host system can handle the SPI Multi-I/O interface speeds up to 80 MHz. Consider the industrial temperature rating if the application environment exceeds standard commercial limits.
This device belongs to the S25FL256S family of MirrorBit Flash memories. The family shares common architectural features such as the Eclipse engine and Multi-I/O support. Variations within the series differ primarily in package type, such as BGA or SOIC, and organizational settings like x8 or x16 bit widths. This specific model represents the serial NOR flash variant optimized for space-constrained designs.
Compatible substitutes include other members of the S25FL256S family with identical pinouts and electrical characteristics. Verify that any replacement maintains the same package dimensions and thermal specifications. Cross-reference the specific suffix codes to ensure matching packaging and environmental ratings.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.