Memory IC S25FL512SAGMFIR13 product image

S25FL512SAGMFIR13

$7.99
  • Description:IC FLASH 512MBIT SPI/QUAD 16SOIC
  • Series:FL-S
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:c13cc4bb2385 Category: Brand:

  
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S25FL512SAGMFIR13 is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC FLASH 512MBIT SPI/QUAD 16SOIC. Review the specifications below when checking this part for your BOM.

Memory IC specifications for S25FL512SAGMFIR13

  • Description:IC FLASH 512MBIT SPI/QUAD 16SOIC
  • Series:FL-S
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:512Mbit
  • Memory Organization:64M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package:16-SOIC
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for S25FL512SAGMFIR13

S25FL512SAGMFIR13

Memory IC Overview

The Infineon S25FL512SAGMFIR13 is a 512 Mbit (64 MB) NOR flash memory utilizing 65 nm MirrorBit technology and Eclipse architecture. It features a 16-pin SOIC package, SPI Multi-I/O interface with DDR support, and operates within a 2.7 V to 3.6 V core voltage range. The device supports up to 133 MHz clock rates for fast read operations and includes a 512-byte page programming buffer. It offers 100,000 program-erase cycle endurance, 20-year data retention, and AEC-Q100 Grade 3 automotive qualification.

Memory IC Feature Summary

  • Supports Single, Dual, and Quad I/O serial commands with Double Data Rate (DDR) options for high-speed data transfer.
  • Integrates an internal hardware Error Correction Code (ECC) generator for single-bit error correction.
  • Features Advanced Sector Protection (ASP) allowing individual sector control via boot code or password.
  • Includes AutoBoot capability to automatically execute read commands at a preselected address upon power-up.

Memory IC Applications

  • Execute-In-Place (XIP) applications requiring direct code execution from memory
  • Automotive embedded systems meeting AEC-Q100 Grade 3 standards
  • Code shadowing and data storage in industrial environments

Memory IC Procurement Notes

Verify the specific suffix 'R13' corresponds to the required tape-and-reel packaging configuration as indicated by distributor listings. Confirm that the Automotive Grade 3 temperature range (-40°C to +85°C) aligns with your system's thermal requirements. Ensure compatibility with existing SPI controllers supporting Multi-I/O and DDR protocols before finalizing procurement.

Memory IC Selection Notes

Select this component when high-density non-volatile storage is required alongside robust automotive reliability standards. The 16-pin SOIC package suits designs needing surface-mount integration without excessive board space. Consider the Eclipse architecture for improved program/erase performance compared to prior generation devices if higher throughput is necessary for your application.

Memory IC Part Context

This part belongs to the S25FL512S series, representing the latest FL-S generation of SPI flash memories. It succeeds previous FL-K and FL-P families, offering increased density and enhanced features like Extended Addressing and AutoBoot while maintaining command set and footprint compatibility for easier migration.

Memory IC Replacement Considerations

Direct replacements include other S25FL512S variants with different packaging or temperature grades, such as S25FL512SAGMFA013. Prior generation equivalents like S25FL256S may require firmware adjustments due to differences in sector size and OTP capacity.

S25FL512SAGMFIR13S25FL512SAGMFIR13
$7.99
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