Memory IC S26HL02GTFGBHB053 product image

S26HL02GTFGBHB053

$26.98
  • Description:IC FLASH 2GBIT HYPERBUS 24FBGA
  • Series:SEMPER™
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR)

SKU:dd7da122cc9c Category: Brand:

  
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S26HL02GTFGBHB053 is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC FLASH 2GBIT HYPERBUS 24FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for S26HL02GTFGBHB053

  • Description:IC FLASH 2GBIT HYPERBUS 24FBGA
  • Series:SEMPER™
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:HyperBus
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-VBGA
  • Supplier Device Package:24-FBGA (8x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for S26HL02GTFGBHB053

S26HL02GTFGBHB053

Memory IC Overview

The Infineon S26HL02GTFGBHB053 is a 2 Gb SEMPER™ NOR Flash device utilizing 45-nm MIRRORBIT™ technology. It features a HYPERBUS™ interface compliant with JEDEC JESD251, supporting DDR operation up to 133 MHz for HL-T variants. The component operates within a supply voltage range of 2.7 V to 3.6 V and is qualified to Automotive AEC-Q100 Grade 2 standards, functioning reliably between -40 °C and +105 °C. Packaged in a 24-ball BGA measuring 8 x 8 mm, it supports legacy SPI modes and includes integrated functional safety mechanisms.

Memory IC Feature Summary

  • ISO 26262 ASIL-B compliance and ASIL-D readiness for functional safety applications
  • Endurance Flex architecture enabling customizable high-endurance or long-retention partitions
  • Integrated SafeBoot diagnostics and built-in ECC for single-bit correction and double-bit detection
  • Multi-chip package (MCP) design with dual stacked 1 Gb dies

Memory IC Applications

  • ADAS domain controllers
  • Autonomous driving systems
  • Motor control units

Memory IC Procurement Notes

Verify the specific ordering suffixes against official documentation to confirm interface boot defaults and temperature grades. Ensure compatibility with system power supplies operating between 2.7 V and 3.6 V. Confirm that the PCB layout accommodates the 24-ball BGA footprint and signal integrity requirements for differential clocking. Validate that the application environment remains within the specified -40 °C to +105 °C operational range.

Memory IC Selection Notes

Select this component when automotive-grade reliability and functional safety certification are required. The HL-T designation indicates a 3.0 V core voltage suitable for standard logic interfaces. Consider the MCP structure for space-constrained designs requiring high density. Evaluate the Endurance Flex feature if the application demands extended data retention beyond standard specifications.

Memory IC Part Context

This part belongs to the SEMPER™ Flash family, engineered specifically for functional safety in critical automotive and industrial systems. The series integrates advanced error correction and diagnostic capabilities directly into the memory array. It represents a transition toward safer embedded storage solutions that meet stringent ISO 26262 standards while maintaining high performance.

Memory IC Replacement Considerations

S26HS02GTFGBHB053

S26HL02GTFGBHB053S26HL02GTFGBHB053
$26.98
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