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S26KS256SDGBHV030 is listed in the Memory IC range at ChipApex. The manufacturer field lists Spansion. Its product description is FLASH, 32MX8, 96NS, PBGA24. Review the specifications below when checking this part for your BOM.
The S26KS256SDGBHV030 is a 256 Mbit (32 M x 8) HyperFlash NOR memory device manufactured by Infineon Technologies, formerly Spansion. It operates with a 1.8V supply voltage and supports clock frequencies up to 133 MHz. The component utilizes a synchronous parallel interface within a 24-pin FBGA package measuring 6x8 mm. It features an initial random read access time of 96 ns and is designed for automotive applications, meeting AEC-Q100 standards with an operating temperature range from -40°C to +105°C.
Verify the manufacturer designation as Infineon Technologies, which acquired Spansion, when sourcing this component. Confirm the specific suffix HV indicates the extended industrial/automotive temperature grade. Ensure the package type matches the required 24-FBGA footprint on the target PCB layout. Check for RoHS compliance documentation relevant to the manufacturing date code.
Select this part when a synchronous parallel interface is preferred over SPI for higher bandwidth requirements. Compare against the S26KL series if lower power consumption at reduced clock speeds is acceptable. Consider the 256 Mbit density relative to system memory constraints. Verify that the 1.8V I/O logic levels are compatible with the host microcontroller or processor.
This device belongs to the S26KS family of HyperFlash memories, designed to replace traditional parallel NOR flash in high-performance embedded applications. It offers faster boot times and improved read performance compared to asynchronous counterparts. The family includes variants with different densities and voltage options, catering to diverse automotive and industrial storage needs.
Direct substitutes include other S26KS256 variants with compatible pinouts and electrical characteristics. Verify that any replacement maintains the same HyperBus protocol support and automotive qualification status. Cross-reference package dimensions to ensure mechanical compatibility without redesigning the board.
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