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S29GL032N11FFIS10A is listed in the Memory IC range at ChipApex. The manufacturer field lists Spansion. Its product description is IC FLASH 32MBIT PARALLEL 64FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for S29GL032N11FFIS10A
- Description：IC FLASH 32MBIT PARALLEL 64FBGA
- Series：GL-N
- Mfr：Spansion
- Package：Bulk
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：32Mbit
- Memory Organization：4M x 8, 2M x 16
- Memory Interface：Parallel
- Clock Frequency：-
- Write Cycle Time - Word, Page：110ns
- Voltage - Supply：1.65V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：64-LBGA
- Supplier Device Package：64-FBGA (13x11)
- Access Time：110 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for S29GL032N11FFIS10A
Memory IC Overview
The S29GL032N11FFIS10A is a 32 Megabit (4M x 8 or 2M x 16) NOR Flash memory component from the Spansion GL-N series. It utilizes 110 nm MirrorBit process technology and operates on a single 3.0 Volt supply. The device features an access time of 110 ns and supports page mode operations. It is housed in a 64-pin FBGA package with dimensions of 13x11 mm. Key electrical parameters include a voltage range of 1.65V to 3.6V and an operating temperature range of -40°C to 85°C.
Memory IC Feature Summary
- Supports Page Mode for high-speed sequential data reads
- Utilizes 110 nm MirrorBit process technology for density
- Features Command User Interface for standard flash operations
- Includes Data Polling for status monitoring
Memory IC Applications
- Embedded systems requiring non-volatile code storage
- IoT devices needing low-power flash solutions
- Mobile applications with space constraints
Memory IC Procurement Notes
Verify the specific suffix 'S10A' against official Spansion documentation to confirm pinout, voltage tolerance, and environmental ratings. Ensure the 64-FBGA package dimensions match the target PCB footprint. Confirm RoHS compliance status as indicated in the latest datasheet revision before finalizing procurement specifications.
Memory IC Selection Notes
Select this part when a 32Mbit capacity is required with 110 ns access speed. It is suitable for designs needing a 3V-only supply or wider voltage tolerance up to 3.6V. Consider the FBGA package size if board real estate is limited compared to TSOP options.
Memory IC Part Context
This component belongs to the S29GL-N MirrorBit Flash Family, which includes variants like S29GL512N and S29GL256N. These parts share common interface protocols and command sets but differ in density and package options. The GL-N series is characterized by its use of 110 nm technology.
Memory IC Replacement Considerations
Direct substitutes within the same family include S29GL032N11FAI010 or S29GL032N11FFI010, provided the package type (FBGA vs TSOP) and suffix variations are compatible with the design requirements.
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