S29GL064N90TFA023

Memory IC Overview

The S29GL064N90TFA023 is a 64 Megabit (8M x 8 or 4M x 16) NOR Flash memory component manufactured by Spansion. It utilizes the MirrorBit process technology and operates on a single 3.0-Volt power supply with a voltage range of 2.7V to 3.6V. The device features an asynchronous parallel interface with a maximum access time of 90 ns. It is housed in a 56-pin TSOP package and supports symmetric block organization. The component is designed for industrial temperature ranges, typically operating between -40°C and +85°C.

Memory IC Feature Summary

• Supports page mode operations for high-speed sequential reads
• Features command-based user interface for standard flash operations
• Includes data polling and toggle bit mechanisms for status monitoring

Memory IC Applications

• Code storage in embedded systems requiring fast random access
• Firmware storage for microcontrollers and digital signal processors
• Application code execution directly from flash (XIP)

Memory IC Procurement Notes

Verify the specific suffix 'TFA023' against official Spansion or Infineon documentation to confirm exact package dimensions and lead-free status. Ensure compatibility with existing board layouts regarding the 56-pin TSOP footprint. Confirm RoHS compliance requirements match the manufacturing date code. Check for any product discontinuation notices as older Spansion parts may have limited availability.

Memory IC Selection Notes

Select this component when a 64Mbit density with 90ns speed is required in a 56-pin TSOP form factor. It is suitable for designs needing a single 3V supply and symmetric block structures. Compare against the S29GL064A series if newer process nodes are preferred. Ensure the system architecture supports parallel NOR interfaces and handles the specific voltage tolerances of the 2.7V to 3.6V range.

Memory IC Part Context

This part belongs to the S29GL-N family of 3.0-Volt only Page Mode Flash Memories. These devices are based on the 110 nm MirrorBit process technology, which was introduced to replace earlier 200 nm generations like the S29GL-A series. The family offers improved performance and reliability characteristics compared to previous iterations while maintaining pin compatibility within certain package types.