S29GL128P11TFIV20

$4.33

Description：IC FLASH 128MBIT PARALLEL 56TSOP
Series：GL-P
Mfr：Infineon Technologies
Package：Tray

SKU:6f51b79e2e8d Category: Memory IC Brand: Infineon Technologies

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Product introduction

S29GL128P11TFIV20 is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC FLASH 128MBIT PARALLEL 56TSOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for S29GL128P11TFIV20

Description：IC FLASH 128MBIT PARALLEL 56TSOP
Series：GL-P
Mfr：Infineon Technologies
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NOR
Memory Size：128Mbit
Memory Organization：16M x 8
Memory Interface：Parallel
Clock Frequency：-
Write Cycle Time - Word, Page：110ns
Voltage - Supply：1.65V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：56-TFSOP (0.724", 18.40mm Width)
Supplier Device Package：56-TSOP
Access Time：110 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for S29GL128P11TFIV20

S29GL128P11TFIV20

Memory IC Overview

The Infineon S29GL128P11TFIV20 is a 128 Mbit NOR Flash memory device manufactured using 90 nm MirrorBit process technology. It features a parallel interface with an asynchronous timing type and supports a data bus width of 16 bits. The device offers a maximum random access time of 110 ns and a page access time of 25 ns. It operates within a voltage range of 2.7 V to 3.6 V and is available in a 56-pin TSOP package. The component supports industrial temperature ranges from -40°C to +85°C.

Memory IC Feature Summary

Supports VersatileIO control allowing I/O signal levels to operate from 1.65 V to VCC
Includes a 32-word write buffer to reduce overall programming time for multiple-word updates
Features a Secured Silicon Sector region for permanent, secure identification via Electronic Serial Number
Provides program and erase suspend/resume capabilities for efficient system operation

Memory IC Applications

Embedded applications requiring high density and lower power consumption
Systems utilizing Common Flash Interface (CFI) standards
FPGA configuration storage solutions

Memory IC Procurement Notes

Verify the specific ordering suffix to confirm the package material set, as 'F' indicates lead-free composition. Ensure the model number corresponds to the correct speed option and temperature range for your design requirements. Confirm that the selected version matches the intended sector protection settings before procurement.

Memory IC Selection Notes

Select this component when a 128 Mbit capacity with 110 ns access speed is required. The 56-pin TSOP package is suitable for surface-mount assembly. Consider the VersatileIO feature if the host system requires flexible I/O voltage levels between 1.65 V and 3.6 V. Verify compatibility with existing sector protection schemes.

Memory IC Part Context

This part belongs to the S29GL-P family of 3.0 Volt-only Page Flash memories. The family includes densities ranging from 128 Mbit to 1 Gbit, all fabricated on the same 90 nm MirrorBit process technology. These devices share common command sets and architectural features, facilitating migration across different density options within the same product line.