S29GL128S90DHSS20

Memory IC Overview

The S29GL128S90DHSS20 is a 128 Mbit Parallel NOR Flash memory component from Infineon Technologies, utilizing the MirrorBit technology. It features an asynchronous interface with a maximum access time of 90 ns and operates within a voltage range of 2.7 V to 3.6 V. The device is housed in a 64-ball FBGA package suitable for surface mount applications. It supports an organization of 8M x 16 bits and includes lead ball finishes composed of Sn/Ag/Cu. The unit is designed for industrial temperature ranges and holds Automotive quality grade certification.

Memory IC Feature Summary

• Utilizes MirrorBit technology for high-density non-volatile storage
• Supports automotive quality standards for reliable operation
• Features asynchronous parallel interface for direct code execution

Memory IC Applications

• Automotive embedded systems requiring robust data storage
• Industrial control units needing code execution capability
• Consumer electronics firmware storage

Memory IC Procurement Notes

Verify the specific suffix DHSS20 against official Infineon documentation to confirm package type and temperature range. Ensure compatibility with existing board layouts for FBGA-64 footprints. Check moisture sensitivity levels and reflow soldering profiles during assembly planning. Confirm RoHS compliance status through current datasheets before finalizing procurement orders.

Memory IC Selection Notes

Select this part when a 128 Mbit capacity with 90 ns access speed is required for parallel NOR applications. Consider the FBGA-64 package constraints and automotive qualification requirements. Evaluate power consumption specifications against system battery or supply limits. Compare alternative speeds if faster access times are necessary for performance-critical designs.

Memory IC Part Context

This component belongs to the S29GL128S series of NOR flash memories. The GL-S designation indicates its classification within Infineon's portfolio for high-reliability applications. It shares architectural similarities with other devices in the family but differs in specific timing parameters and packaging options defined by its unique model number.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult official Infineon cross-reference guides for verified alternatives.